Following the launch of AMD's EPYC 'Venice' CPUs in July, AMD extended the performance claims for its upcoming generation of server chips on Friday. The high-level claim hasn't changed. AMD still says a 96-core, high-frequency Venice chip is around 20% faster than Nvidia's 88-core Vera in SPEC CPU 2026's Integer Rate test. However, the company went into far greater detail about the benchmarks in a new white paper.

There are several configuration differences depending on the benchmark throughout AMD's white paper, and although we'll call out those differences here to the best of our ability, we don't have all of the details. For the Vera comparison, in particular, AMD is mixing data from different sources, and in some cases, using different major releases of the GNU Compiler Collection (GCC). That can have a substantial impact on performance, so keep your salt shaker handy.

First up are results in SPEC CPU 2026 with the intrate test, looking at total throughput. These are older numbers, gathered in July with GCC 15.2. The intrate test runs multiple copies of an application on the same CPU, and the SOP is to run one copy per thread. Presumably, that's what AMD did here, but the white paper doesn't clarify, even in the footnotes.

The 256-core 9996 is 2.37x faster than the Intel Xeon 6980P and 2.24x faster than Vera according to the slide. The white paper clarifies the mystery 9006 CPU is the 256-core flagship. Perhaps most impressive is AMD's gen-on-gen comparison. According to these results, the 9996 is around 78% faster than last-gen's 192-core EPYC 9965.

Although the high-level results bring in data from Intel and AWS, much of the white paper focused squarely on the comparison between Venice and Vera. AMD broke down the individual subtests of SPEC CPU 2026 intrate in the white paper, which you can see below.

The comparison looks good for AMD, naturally, though there are a few wrinkles in the configuration. AMD is testing a down-cored EPYC 9996, dropping from 256 cores to 96 cores. It made no mention of power budget, but when AMD originally shared SPEC numbers, the 96-core model had access to the same 600W as the 256-core model — AMD's 96-core, high-frequency Venice SKU tops out at 500W. More consequential is the compiler, however. AMD is using GCC 16.1 and comparing the results to the ones Nvidia shared in its Vera white paper. Nvidia used GCC 15.2.

Michael Larabel over at Phoronix has a nice write-up about the difference between GCC 15 and 16, but the short story is that there are performance differences, not always for the better. GCC 16 takes longer to compile due to better optimizations, hence the lower scores on the GCC and LLVM compilations above. However, that leads to faster binaries. By how much depends on the flags, software, and a whole host of other factors. Regardless, it's not best practice to compare benchmarks using two different compiler versions.

Speaking of Phoronix, AMD pulled some data for the publication's initial, controlled testing of Vera. Above, you can see the Stream, an industry-standard benchmark for measuring memory bandwidth. Again, AMD is using a down-cored 9996 from 256 cores to 96, and offering it a 600W power budget. Still, this is an impressive showing, as Vera absolutely clobbered the competition in the publication’s original Stream results. Here, AMD is ahead by about 18%, with per-core performance about 8% ahead.

Breaking out of Vera, AMD also showed performance in cloud workloads, including database, Java, and cryptography. Once again, the gen-on-gen comparison stands out, as AMD was already leading in these workloads with its last-gen chips. AMD ran these tests itself, rather than relying on third-party data, though the Graviton5 results came from an AWS cloud instance.

Similarly, in HPC workloads, AMD furthers its lead over Intel's flagship Granite Rapids-AP offering. Intel's next-gen data center CPUs, codenamed Diamond Rapids, are set to be released next year.

Finally, we have "agentic AI workload performance," which uses actual benchmarks for comparison, despite what the names in the chart above suggest. From left to right, AMD used NGINX, TPCx-AI kit, FAISS, TPC-H and TPC-C, and a replay of a multi-persona agent. For TPC-H and TPC-C, AMD says it derived workloads from those benchmarks, so the results here aren't comparable to published results.

Although looking at benchmark results is always interesting, it doesn't say much in the context of a server deployment, at least at the scale that AMD is targeting. Peak performance is only one of the major factors that go into server deployments, after all, and even then, performance can vary wildly depending on what software you're running and how it's built.

Still, Venice looks impressive, perhaps more so in the gen-on-gen comparison than any competitive comparison. Hopefully that bodes well for AMD's future Zen 6 rollout on consumer desktops, but we'll have to wait until Team Red has more to share before drawing any conclusions on that front.

Intel's Nova Lake CPUs are no stranger to leaks. We've been talking about the processors for close to two years now, with rumors swirling about bLLC and a 52-core flagship for well over a year. However, this week (and this month more broadly), we've seen leaks hit a fever pitch, suggesting that Intel is finally gearing up to release a generation of processors that's been the zeitgeist for over 24 months.

Intel hasn't shied away from discussing Nova Lake, with Intel's enthusiast channel VP Robert Hallock telling Tom's Hardware Premium that it's one of the most important launches for the company ever. At the beginning of the year, Intel CEO Lip-Bu Tan said that Nova Lake would launch in the second half of 2026, and despite expected hubbub about delays/cancellations, that's the North Star Intel itself has set. So, that's also going to be our North Star here.

There are three stories that have come out over the past week and a half. First, a screenshot of some high-level details about Nova Lake surfaced online, showing the launch schedule and platform details. The slide in question is almost certainly from one of Intel's partners and not Intel itself.

Just in the past few days, we've also seen a barrage of Z990 motherboards from ASRock surface in the NBD shipping database, as well as some entries in the SiSoftware database for a next-gen HP EliteBook X sporting an unknown Intel processor.

An increase in the number of leaks/rumors, especially those that are more than a known leaker writing up a post on X, usually points to an imminent launch. We've heard about Nova Lake for over two years, yes, but now we're seeing more concrete details. In addition to the shipping manifest, snapped slide, and SiSoftware results, we also saw two Z990 motherboards ourselves at Computex earlier this year, with a third rumored. We will not predict the Nova Lake release date here. However, the launch is coming soon. That much we're confident in.

Intel's typical release cycle for desktop CPUs

In order to establish a timeline, we first need to look back. We could go back far, but we're cutting the timeline short here at Alder Lake. That was when Intel finally moved off 14nm, following generation after generation of either an underwhelming launch or a delayed one, and it's most relevant to what Intel is doing today.

The timeline above is fairly straightforward. Intel has, short of 2025, launched a new generation of desktop processors in the fall every year for the past five years. This annual cadence was even more intense previously; 7th-Gen and 8th-Gen CPUs were both released in 2017, and 9th-Gen in 2018. Then, Intel took a year off and followed up with 10th-Gen in 2020 and 11th-Gen in early 2021. Keep in mind that we're talking about desktop CPU launches with a new microarchitecture here. Obviously, Intel has released a ton of other products in between the gaps.

The interesting bit about the timeline is actually the end with Arrow Lake Refresh. When we spoke to Robert Hallock earlier this year, he told us that a team that was "pretty much completely different" worked on Arrow Lake Refresh compared to Arrow Lake. That might explain the strangely large gap between Arrow Lake and Arrow Lake Refresh. Even looking at the Arrow Lake and Arrow Lake Refresh stacks side-by-side, it's obvious that a different mentality went into how they were positioned in the market. That team is in in-place now, and Hallock told us the team is "moving faster than we ever have in product, in release cadence."

Don't take Hallock's comments about Intel moving faster than ever at face value — he was probably being at least a little hyperbolic — but the sentiment is clear. Following the poor reception of Arrow Lake, Intel reorganized and set a new roadmap in motion that extends out to 2030, and now, that roadmap is being executed, starting earlier this year with Arrow Lake Refresh. That sets up Arrow Lake Refresh similar to 11th-Gen Rocket Lake, serving as somewhat of a stopgap before the next generation properly arrives (that is, thankfully, where the comparisons between Arrow Lake Refresh and Rocket Lake end).

Back to Nova Lake. Earlier this year at Computex, we saw two Z990 motherboards, one of which we confirmed was not a finalized unit. The complete development process takes generally four to six months for a motherboard, and you can add another two months or so on top of that for channel sales, as pallets of PCBs are loaded onto ships and swim across the Pacific Ocean. That was in June.

The shipping manifest that surfaced this week showed shipments in July for ASRock. Critically, it also shows shipments from two different sources: Taiwan and Vietnam. Given what we saw at Computex and the two different sources for ASRock, we're firmly past the early prototype and engineering validation stage of motherboard design. Assuming everything goes according to plan, that means Z990 motherboards should be ready to go on store shelves by no later than October or November.

Keep in mind that does not mean Nova Lake will launch in October or November, just that motherboards will most likely be ready by then. This aligns with what motherboard vendors told us earlier this year, with some brands pointing to Q3 but most to Q4 for a Z990 rollout.

Parsing the details about Nova Lake so far

Currently, there are two camps when it comes to when Nova Lake will release. Some say it'll arrive this year, likely in Q4, while others say CES 2027 in January of next year. As we wrote earlier in the article, we will not predict the Nova Lake release date. However, we will side with one of the camps here as more likely based on what we've seen so far.

Given everything we've seen, a late 2026 launch is more likely. The strongest evidence of that is the comment from Tan earlier this year, where the executive said Nova Lake is "coming at the end of 2026." The critical context is that Tan made that comment as part of his prepared remarks, preceding the actual financials that you hear in an earnings call. An earnings call is not a keynote, and making material promises you knowingly can't keep can land you in hot water.

Executives massage the truth all the time during earnings calls — that's half the reason there are prepared remarks ahead of the financials. However, that key detail about an end of 2026 launch isn't massaging the truth. It's a concrete claim devoid of weasel words and qualifiers. In addition, Intel's fiscal year aligns with a calendar year; when Tan said end of 2026, he meant end of 2026, regardless of fiscal or calendar year.

It's possible that something changed between now and January when that call took place. However, the timeline still lines up given the various motherboards that showed up between June and July of this year. At this point, Intel can slide the actual release date around by a bit, but not by months. Retailers aren't going to sit on pallets of motherboards with no home indefinitely.

The one wrinkle in this is the leaked slide you can see above, which claims Nova Lake will enter mass production in Q4, with a launch in Q1 2027. There are reasons to be skeptical of this slide, however. For starters, the slide doesn't say anything that hasn't been heavily rumored for months (sometimes even years) at this point: 52-core flagship, up to 288MB of bLLC, LGA 1954 socket, and multi-generation socket support. The strange bit is a mention of Hammer Lake at the bottom of the slide.

We've heard very little about Hammer Lake, and nothing that's passed muster for us to cover on Tom's Hardware. Even among the rumors, the launch has been pinned somewhere in the 2029/2030 range, if the lineup is even real to begin with. Regardless, Hammer Lake isn't what we'd expect to see next to Razor Lake — the generation rumored to follow Nova — and certainly not what we'd expect to see under a "Q4 2027+" badge.

That doesn't mean the slide is fake; it doesn't appear to be fake. There's some very critical context missing from it, though. It's a Chinese source, but did it come from an OEM? A distributor? A retailer? The validity of the slide changes dramatically depending on that. Further, we're only seeing maybe half of a single slide here. There's too much context missing to take this single slide and run with it as concrete truth.

At the very least, it fares poorly against prepared comments made by Intel's CEO, motherboards we've seen (and held) ourselves, and have circulated through photos online, and strong indications from Intel's motherboard partners that they'll be ready for a launch in Q4. Add on top of that the fact that Intel took 2025 completely off for new desktop launches (and its usual cadence of launching in the fall), and a Q4 rollout of Nova Lake looks far more likely.

Likely isn't the same as confirmed. We're still awaiting details on Nova Lake from Intel proper, and hopefully those will arrive soon. Given the anticipation Intel has already built around Nova Lake without a single performance claim or spec shared, we'll have a lot to talk about.

Elegoo has a huge sale right now, making it a great time to pick up a new 3D printer. This special Elegoo Day sale on new 3D printers is running throughout September to celebrate its community of makers, with limited-time discounts across its whole range, with resin and filament also on sale. You can score up to 40% off a new 3D printer right now, but you'll have to be quick about it.

● Check out these Elegoo 3D printer sales

Elegoo has placed almost its entire range of 3D printers on sale. One of its best offers lets you pick up an Elegoo Centuari Carbon 2 Combo, along with 1KG of filament, for just $400. The printer is just $399 right now, but the extra dollar gets you 1KG of PLA filament on top.

You've also got 26% off the ultra-big OrangeStorm Giga, now $2,299. At the other end, you can score 37% off the Neptune 4 Plus, down to $269. Beginner-friendly resin printers, like the Mars 5 Ultra, are also on sale, down to $259.

This Elegoo Day flash sale isn't going to be around forever. The discounts will end on September 29, 2026, at 3 AM ET, but there's no guarantee that the stock will last until then, so you'd better be quick.

Elegoo FDM 3D Printer Deals

Elegoo Resin 3D Printer Deals

Elegoo 3D Printer Filament and Resin Deals

A new report claims Chinese DRAM champion CXMT is eyeing production of 3D NAND memory. Reuters reports, citing three people familiar with the company's plans, that CXMT intends to build a 3D NAND R&D production line at its second manufacturing facility near Beijing. There is no information on when the experimental production line will become operational, though, given that CXMT's second Beijing fab has not even broken ground yet, the line is at least two or three years away. In addition, the memory maker has established a research institute in Beijing that has NAND flash development among its projects, according to one source. CXMT has not formally confirmed any 3D NAND initiatives, so the information should be taken with a grain of salt.

For now, there are no details on CXMT's 3D NAND architecture, number of active layers, process technology, expected performance, or production capacity. Nevertheless, the report claims that CXMT has already discussed its NAND ambitions with prospective customers. One of them is said to be a recently established company that plans to use CXMT-made NAND devices in storage products aimed at AI and supercomputing applications.

It remains to be seen whether CXMT's 3D NAND project will eventually progress to high-volume manufacturing, but if it does, the initiative will take CXMT beyond its traditional DRAM specialization and directly into YMTC's territory. Until recently, China's two major memory producers had focused exclusively on their 3D NAND and DRAM realms where they have achieved quite a success. Yet, it looks like both companies want to become one-stop shops for DRAM and NAND — just like their bigger rivals Micron, Samsung, and SK hynix — as YMTC is reportedly exploring DRAM production.

While CXMT's alleged plan to build 3D NAND may look somewhat logical from business diversification point of view, it does not make a lot of commercial sense for now.

Or China's industrial policy?

CXMT is China's dominant DRAM producer and posted $22.41 billion in revenue and $11.57 billion in net profit in the first half of the year after years of bleeding money. Despite obvious success, the company is still considerably smaller than the Big Three memory suppliers, which means it has plenty of room to expand in the industry where it already has experience, process technology, fabs, and customers. Furthermore, AI gives CXMT an obvious reason to focus resources on advanced DRAM as well as HBM3E, which are arguably much more strategically valuable products than commodity 3D NAND.

That said, for CXMT, allocating resources to 3D NAND, which requires completely different process technologies, manufacturing expertise, and equipment, does not make much economic sense. However, from the Chinese government's perspective, turning CXMT into the country's second major 3D NAND producer fits almost perfectly within its semiconductor self-sufficiency plans.

CXMT was created with Hefei government money (which held a 37% stake in the company during its IPO) and received support from China's Big Fund, which means that federal and local governments retain control over the company and may shape its strategic decisions, which is exactly what they do. Whether or not CXMT can indeed become a decent 3D NAND maker is an entirely different question.