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Received before yesterdayIT-News

Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks

TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expansion to meet increasing demand for AI accelerators.

Nvidia and SK hynix ink multi-year memory co-development and supply agreement — seeks to address extended development cycles

Nvidia and SK hynix have inked a multi-year collaboration agreement under which the companies will co-develop next-generation memory technologies for Nvidia's upcoming platforms and SK hynix will supply them to Nvidia.

Astera Labs showcases 320-lane PCIe 6.0 switch for vendor-agnostic scaling in data centers — up to 80 accelerators can be scaled up using PCIe alone

Astera Labs has shown off the Scorpio X-Series 320-lane PCIe switch that promises to enable vendor-agnostic scale-up capability for AI infrastructure and disaggregated data center infrastructure.

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