China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.

Intel sees 'inbound interest' for 18A-P process technology despite 18A process variability.

Rebellions details how it developed one of the world's first quad-chiplet AI accelerator with UCIe interconnects and how it did not use all of the technologies that the UCIe 1.0 specifications includes.

Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,

Under the arrangement, the government will initially hold roughly 10% of Rapidus's voting shares and the majority of its stake in non-voting stock.

Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.

Naga Chandrasekaran promoted to Chief Technology and Operations Officer as well as the general manager of Intel Foundry responsible for development of advanced process technologies and day-to-day operations.

Sources told Reuters that some U.S. chipmaking firms are running low on scandium — a crucial rare earth material for making 5G chips — as they suffer delays from acquiring export licenses from Beijing.

Chinese foundries looking to increase 7nm and below capacity to 100,000 wafer starts per month in one or two years, says Nikkei.

A new investigative report from The New York Times reveals that, in July 2023, senior US intelligence officials privately briefed some of the tech industry's most powerful executives on classified assessments regarding China and Taiwan.

ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.

After 10 years and hundreds of billions of investments, China's semiconductor supply chain is still decades behind chip supply chain in America and Taiwan.

TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules.

Automaker BMW has filed a patent for a new fastener which takes design cues from the its iconic segmented roundel logo. but it has been accused of creating this design for service and repair gatekeeping.

Japan’s state-backed foundry Rapidus plans to begin production of 2nm-class semiconductors in the second half of its fiscal year 2027, with full-scale production expected in 2028.

Tachyum forced to vacate R&D office due to unpaid rent, wages, and taxes

“We’re easily going to get over a trillion transistors… in the package, by the end of the decade,” Cadence Senior Vice President Paul Cunningham claims.

Rising DRAM and NAND prices driven by AI megatrend and amplified by memory overbooking are hitting sales of inexpensive consumer electronics and smartphones, which affects orders of entry-level processors to foundries, according to SMIC.

Bipartisan group of lawmakers want the U.S. government to impose export controls on all wafer fab equipment bound to China except those that can be made locally and make allies do the following.