TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expansion to meet increasing demand for AI accelerators.

Chinese startup Prinano claims it produced 8-inch photonic chip wafers without DUV lithography, using nanoimprint technology that cuts costs by 90%.

TSMC says it does not have enough capacity to handle all the demand from AI hyperscalers, with CEO C.C. Wei saying that it will take a long time before it can match customer demand. This is an opportunity for Intel, though, as companies desperate to get their hands on advanced chips might be willing to use Intel 18A or 14A nodes for their needs instead.

Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.

Thousands of SK hynix employees fled their factory stations earlier today as a fire broke out in a room where fluorine gas was used.

TikTok owner Bytedance reportedly developing its own custom CPUs in a bid to reduce costs and dependence from US chipmakers

We explore Globalfoundries, UMC, and SMIC's individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.

The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.

SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-killing thermal throttling.

Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing ecosystem.

Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potentially helping China narrow the gap with TSMC and Nvidia despite U.S. sanctions.

It’s understood that meetings are being canceled across Samsung's non-memory and shared business units.

ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.

AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC's N2 process in Taiwan.

Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.

China's semiconductor equipment vendors collectively posted record revenues in 2025, but profitability is under pressure from domestic price competition.