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Received today — 20. Dezember 2025Tom's Hardware

Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers — new standard set to offer reduced power consumption and double the bandwidth versus DDR5 RDIMMs

19. Dezember 2025 um 18:56
Samsung has announced its own SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms, pitching it as as a way to bring the power efficiency and bandwidth advantages of LPDDR5X into servers.

Here's why HBM is coming for your PC's RAM — HBM consumes around three times the wafer capacity of DDR5 per gigabyte, as AI supercharges demand for chips and advanced packaging

19. Dezember 2025 um 17:36
AI’s appetite for high-bandwidth memory is reshaping the global DRAM and NAND market, diverting wafer capacity and advanced packaging away from consumer products and driving sharp price increases across markets.

Received yesterday — 19. Dezember 2025Tom's Hardware
Received before yesterdayTom's Hardware
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