In a press Q&A at CES 2026, Nvidia CEO Jensen Huang addressed everything from Rubin’s design philosophy to inference economics, power constraints, open models, and more.
At this year's CES, AMD felt like a dominant force, too focused on AI potential to talk about (or to) consumers. Intel looked more like a laser-focused startup, confidently pitching its Panther Lake chips to gamers, laptop users, and even robot makers.
The 6GW will come from various suppliers — both existing and upcoming — to deliver the estimated 1GW that Meta's Prometheus site will require in 2026, and the 5GW its Hyperion data center will need by 2028.
Following Intel's keynote at CES 2026, we attended a press Q&A at CES in Las Vegas, featuring some of the senior staff behind Intel's Panther Lake architecture, with some illuminating commentary about the new products.
President Donald Trump and Commerce Secretary Howard Lutnick went on their respective social media platforms to praise Intel and its CEO, Lip-Bu Tan, for the launch of the first chips made using the Intel 18A process node. They also said that it's another step towards the U.S. regaining its lead in cutting-edge chip manufacturing.
Chinese researchers have demonstrated a 4F² dual-gate 2T0C capacitor-less, DRAM-like memory cell with multi-bit storage, fast writes, and long retention. In theory, the technology could be used as embedded or stacked 3D memory, but questions remain about its manufacturability and commercial viability.
HBM4 memory is now expected to reach volume production no earlier than the end of Q1 2026 due to Nvidia's decision to revise its memory specs upward for its next-gen Rubin GPU platform.
Sandisk and other key suppliers of 3D NAND are projected to significantly increase prices of enterprise-grade 3D NAND memory in the coming months due to overwhelming demand from the AI sector.
Nvidia has reportedly imposed non-refundable, full upfront payment terms on H200 GPU sales to China-based clients to hedge regulatory risks as Chinese customers had ordered more than 2 million H200 units that the company yet has to make.
CES 2026 was constrained by the RAM and storage demands of AI hyperscalers, limiting consumer GPU and storage launches. But there was still plenty of innovation to be found, including Intel’s new Core Ultra Series 3 laptop CPUs, brighter, bigger, and faster monitors, and exciting new PC cases and peripherals.