Lese-Ansicht

Unreal Engine 5.7 brings significant improvements over the notoriously demanding 5.4 version, tester claims — benchmark shows up to 25% GPU performance increase, 35% CPU boost

Epic is making strides with Unreal Engine 5's development trajectory, fixing performance issues that've bogged down many new releases. The latest version, UE 5.7, reportedly not only improves CPU and GPU-bound performance but ups the visual fidelity, without any real downsides.

  •  

AI surpasses 2024 Bitcoin mining in energy usage, uses more H20 than the bottles of water people drink globally, study claims — says AI demand could hit 23GW and up to 764 billion liters of water in 2025

A study finds that AI has surpassed Bitcoin and the bottled water industry in its use of resources, with other experts saying that the estimate is actually conservative.

  •  

China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028

China has reportedly built and begun testing a secret EUV lithography prototype using ASML-style laser-produced plasma technology. Yet, despite generating 13.5-nm light, the system remains unable to make chips and appears to be years away from achieving a complete, production-ready EUV manufacturing capability.

  •  

AMD's rumored Ryzen 7 9850X3D spotted at Swiss and U.S. retailers — listings reveal preliminary price of ~$550-600, significantly higher than 9800X3D's $449 MSRP

The Ryzen 7 9850X3D has been spotted at two retailers with slightly different prices, suggesting it would cost between $550 to $600, which is quickly coming up with CES 2026 right around the corner. These early listings are likely inaccurate and should be taken with a huge grain of salt, especially considering that the 9800X3D launched at a $479 MSRP.

  •  

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for future AI and HPC chiplet packages.

  •