Kioxia and Sandisk last week said they had started sampling of their latest 3D NAND memory with 332 active layers that features a combination of the industry's leading areal density and performance. The new 10th Generation BiCS 3D TLC NAND is set to address density and performance-sensitive data center applications, as well as promises to surpass Samsung’s latest V10-class 3D NAND in terms of storage density.

Unlike the previous generations, 10th Generation BiCS (BiCS10) is explicitly aimed at data center-grade storage, where bit density and performance are more important than cost. Indeed, the new type of memory features a 332-layer active layer architecture, greater than 29 Gb/mm² density, and a 4,800 MT/s data transfer rate to enable extreme performance for data center solid-state drives featuring PCIe 5.0 and 6.0 interfaces. Kioxia and Sandisk plan to offer BiCS9 NAND specifically for client applications.

When we normally describe 3D NAND memory, we usually mention all possible applications, which include high-end consumer SSDs (after all, we are Tom's Hardware, we are hardware enthusiasts!) and data center drives. We did not mention consumer applications for BiCS10 for a very specific reason: Kioxia does not position this generation for client devices and only targets data center-grade drives. Whether or not to expect BiCS10 on a high-performance SSD near you probably depends on supply and demand, given the current market circumstances.

While the BiCS10 332-layer 3D NAND boosts bit density by 59% all the way to over 29 Gb/mm², it also promises to deliver meaningful performance and efficiency gains specifically for enterprise applications. Kioxia claims read latency drops by around 4 microseconds (about 10%), while read energy consumption is reduced by 25%, from roughly 100 mJ/GB to approximately 75 mJ/GB.

According to Kioxia, these improvements stem from a redesigned read scheme that changes how unselected word lines behave during consecutive read operations. In a 332-layer NAND stack, a significant portion of read latency and power consumption is associated with repeatedly charging long word lines from ground (VSS) to the read voltage (VREAD).

Normally, NAND memory discharges its wordlines to ground (VSS) after every read, which is a general-purpose approach that works regardless of what the next operation is. However, there is no need to discharge at all times. Therefore, during continuous read operations, the word lines are not fully discharged in the case of BiCS10. Instead, they are lowered to an intermediate voltage and then raised back to VREAD for the next read, which makes a lot of sense for read-heavy applications (most cloud applications are).

After the initial read, the circuitry reduces the word-line voltage only to an intermediate level instead of completely discharging it to VSS. Before the next access, the voltage is restored to VREAD from that intermediate level rather than from ground. Since the voltage excursion is considerably smaller, the word lines recharge more quickly and require less current, which improves both read latency and energy efficiency. The approach is particularly beneficial for very tall 3D NAND stacks, where long word lines amplify charging delays and power losses during sustained sequential read workloads.

It is interesting to note that Kioxia and Sandisk plan to manufacture their BiCS9 and BiCS10 3D NAND products at different production sites. The newest Fab 2 facility in Kitakami, Iwate Prefecture, will handle production of the flagship 332-layer BiCS10 memory, while the long-established Yokkaichi complex in Mie Prefecture will continue manufacturing the 218-layer BiCS9 generation.

This manufacturing split makes a lot of sense. Fab 2 is equipped with Kioxia’s most advanced production tools, so it is better suited to manufacture the highest-density NAND from Kioxia and Sandisk. Meanwhile, the mature Yokkaichi fabs are well-suited for client-oriented BiCS9 production. The manufacturing facility has largely been depreciated, which enables the company to manufacture mainstream NAND at lower cost and reserve its newest capacity in Kitakami for leading-edge products.

As the memory and storage chip crisis continues to squeeze the market, some PC manufacturers began looking at alternative sources earlier this year just to meet consumer demand. Notebookcheck discovered in its review of the Lenovo ThinkBook 14 G9 IPL that it came with a 512GB YMTC M.2 NVMe PCIe 4.0 SSD. What’s more interesting is that the laptop is readily available in the U.S., and you can order it on Amazon for $1,124.25 at the time of writing.

This is the first recorded instance that a laptop from a major OEM is being sold in the United States with a YMTC SSD, which is particularly curious given that the company was added to the U.S. Department of Commerce’s Entity List in 2022. While this prevented the company from acquiring goods and services that were made with or contained American technologies, it does not prevent Lenovo, whose headquarters are in China, from importing such drives into the U.S.

Major PC manufacturers have traditionally relied on established storage chip makers such as Samsung, SK hynix, Kioxia, Micron, and SanDisk, but the ongoing AI buildout has driven prices through the roof. Even Apple, which previously held significant influence over suppliers, is now seeking a blessing from the U.S. government to buy memory chips from the Chinese firm CXMT. Although it’s not on the Entity List, it’s still designated as a Chinese military company, meaning that doing business with it would carry some risk for an American company.

Notebookcheck says that the YMTC drive’s performance “is below average for an SSD in an office laptop,” meaning it could not compete against the best SSDs you can buy today. Most buyers likely won't care about this, especially since the Lenovo ThinkBook 14 G9 IPL is marketed as an office laptop for everyday use. This means that its target market will likely be unfamiliar with specifications like read/write speeds and will probably be satisfied as long as it’s faster than a hard drive.

Lenovo’s deployment of YMTC drives is particularly important because it’s one of the largest laptop brands in the U.S. by volume. In fact, even as PC shipments fell by 7% in the first quarter of 2026, Lenovo’s market share actually grew by 1.2%, making it the third largest desktop and notebook brand after Dell and HP. Since the Lenovo ThinkBook 14 G9 IPL is a relatively affordable laptop designed for office use, it would likely sell many units through enterprise purchases and help increase the adoption of Chinese storage solutions in the U.S.

Since YMTC is also listed as a Chinese military company, institutions looking to buy this particular model may face procurement challenges, especially if they operate in sensitive industries or are government agencies. However, it seems that the memory chip crisis has grown to the point where it’s willing to offer a model it won’t be able to sell in some instances. Nevertheless, this helps ensure that buyers without restrictions have a more affordable option.